Attend Image Sensors 2012 in London

March 9, 2012 – BUSINESS WIRE — Image Sensors 2012, March 20-22 in London, will highlight the emergence of CMOS image sensors against those based on thin film transistors (TFTs), applications possibilities for 3D cameras and non-visual spectrum cameras, and more.

Also read: Insights in Image Sensing from blogger Dr. Phil Garrou

"3D cameras could offer amazing possibilities of improvement in many areas like automotive, security and surveillance, cultural heritage preservation, ambient-assisted living, industrial control," says Dr David Stoppa of Fondazione Bruno Kessler.

SoftKinetic, a leading company in gesture recognition, have the view that this technology “will dramatically improve some established user interfaces, like the television for example. We also see user interactions emerging, where previously there were none: digital signage is a good example of such a market,” notes their CTO, Daniël Van Nieuwenhove.

For non-visible spectrum applications, Dr Renato Turchetta of RAL highlights that "in large area applications, like mammography or chest radiography, TFT technology has been the major player for many years now. CMOS technology is starting to emerge and it could become the major player in the next few years."

Dr. Eric R. Fossum, a primary inventor of the CMOS image sensor (CIS), will talk about his own current project, Quanta Image Sensing (QIS), which has potential to bring a new generation of change. On other disruptive technologies, he says, "I think use of non-silicon materials could be disruptive if any of them work out. Meanwhile, the rate of continuous improvement is so large that emerging technologies have to mature rapidly to have enough compelling advantage that they can grab a toehold in the marketplace once they get there. To that end, even a few years of continuous improvement can look disruptive to the user community."

The Image Sensors 2012 conference will take place March 20-22, 2012, Hotel Russell, London. For more information, visit

View recent issues of the MEMS Direct newsletter


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...