Imec ultrathin chip packaging yields improved

March 23, 2012 — Research organization imec introduces important changes to its ultrathin chip packaging (UTCP) technology, increasing yields 15-20%. Used to package various chips, the technology now offers yields of up to 90%. Extremely miniaturized chip packages can be fabricated, enabling flexible integration to obtain conformable circuitry.

Target applications include wearable medical devices and other novel uses.


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