Kulicke & Soffa semiconductor wafer dicing blades tuned for discretes

March 9, 2012 — Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched its AccuPlus Hub Blades product line, customizable blades for discrete wafer dicing.  

Discrete semiconductors are fabbed on thinned wafers, and die sizes are generally small. This presents die movement and blade loading challenges at the wafer dicing step, notes K&S.

To prevent die chipping and cracks during wafer dicing, key blade elements were optimized: diamond grit size, diamond concentration, and nickel bond hardness. The blades boast a shortened pre-cut process, two special nickel bond hardness series, multi-levels of diamond concentration, and a special hub material and design for high spindle frequency with lower vibration.

The Discrete Series


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