Package and micro-mechanical test equipment installed at DfR Solutions

March 6, 2012 — DfR Solutions, quality, reliability, and durability (QRD) services provider for the electronics industry, installed micro bond and die testing tools from XYZTEC at its College Park, MD headquarters. The Condor Series tools will perform JEDEC JESD22 qualification, dynamic bend testing of small structures, copper wire bond pull and shear testing, and material characterization of lead-free solders.

DfR Solutions selected XYZTECH for package testing after an extensive survey of existing micro testing technologies. The Condor bond testers (systems pictured above and at bottom) perform high-speed shear testing and micro cyclic bend testing. The series offers a range of tools and loadings for precise characterization. A tester can evaluate pull strength on fine-pitch bond wires in multi-stack architectures and high-power die shear strength without changing equipment.

XYZTEC is looking to future expansions at DfR Solutions’ European and Asian facilities to grow the equipment partnership, said Bas van Tilborg, managing director of XYZTEC.

DfR Solutions provides quality, reliability, and durability (QRD) research and consulting for the electronics industry. For more information regarding DfR Solutions, visit

XYZTEC designs and manufactures quality assurance equipment for multiple industries, with a focus on bond testing. For more information about XYZTEC Inc., visit

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