Thermal modeling software aids 3D IC, SoC, SiP designs

March 1, 2012 – Marketwire — Docea Power, power and thermal analysis software supplier, released AceThermalModeler (ATM) for generating compact thermal models of system on chips (SoCs), 3D ICs, systems in package (SiP) devices, and complete boards.

Compact thermal models enable early system floorplan exploration or partitioning, new system packaging and integration architectures, and early exploration of power management policies to reduce peak temperatures and manage temperature gradients across the system.

The ATM tool can be used by thermal experts to create RC compact thermal models quickly, then handed off to the system architecture team to estimate various corner use cases, floorplans, architecture options for multi-core designs, operating points or power management policies impact on temperature across the system.

Enabling early dynamic or steady state estimations of thermal distributions for the most power hungry use cases allows system architects to optimize systems and architectures and avoid loss of revenue due to thermal issues found late in the project.

Docea Power’s Aceplorer simulator considers the relationship between power and temperature. The next tool in the flow is ATM, to perform both thermal steady state or coupled power and thermal analysis for dynamic application profiles running on different architecture configurations.

ATM will be demonstrated at the Design, Automation & Test (DATE) conference in Dresden, Germany, March 12 to 16, 2012.

Docea Power develops and commercializes power and thermal modeling tools for system-level architectues. Learn more at

Subscribe to Solid State Technology/Advanced Packaging

Follow Advanced Packaging on by clicking Or join our Facebook group


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...