TI adds bare die to small-quantity semiconductor packaging options

March 27, 2012 – PRNewswire — Texas Instruments Incorporated (TI, NASDAQ:TXN) now offers bare die in quantities as low as 10 pieces for initial prototyping, and larger quantities (full waffle trays) for production volumes.

Bare die are an option for customers looking to integrate multiple functions into smaller form factors, designing multi-chip modules (MCM) or systems-in-package (SiPs). Bare die can also improve the weight, reliability, and power dissipation specifications of a chip in space-constrained applications. Target applications include mobile RFID readers, consumer smart cards, and medical, industrial, security and high-reliability electronics.

Bare die packaging is available for specific devices in TI’s Analog, Power Management, DSP, and MCU portfolios. Further releases can be evaluated/requested via TI’s HiRel product group. Bare die select devices are available through TI’s standard distribution partners, or at www.ti.com.  

Also read: Texas Instruments (TI) embedded die package teardown report

Texas Instruments provides semiconductor innovations through chip design, manufacturing, and packaging. Learn more about TI’s bare die portfolio at www.ti.com/baredie-pr.

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