TSMC, GLOBALFOUNDRIES fab InvenSense’s CMOS-MEMS chips

March 27, 2012 — Micro electro mechanical system (MEMS) company InvenSense Inc. (NYSE:INVN) announced dual-source capability for its CMOS-MEMS supply from semiconductor foundries Taiwan Semiconductor Manufacturing Company (TSMC) and GLOBALFOUNDRIES.

TSMC has more than doubled its CMOS-MEMS capacity for InvenSense in the past year and has been its primary high-volume supplier to date.

GLOBALFOUNDRIES has now completed the installation of InvenSense’s patented and proprietary fabrication platform on their 8" CMOS production line and is fully qualified for high-volume shipments.

InvenSense says it is the first high-volume MEMS company to use a fabless approach common in the semiconductor industry. The fabless MEMS model allows InvenSense to leverage excess available capacity in many 8” wafer fabs that are fully depreciated and can produce enormous capacity to fulfill all of the market needs for inertial sensors at very competitive prices and little to no cost of capital to InvenSense.

InvenSense’s Nasiri-Fabrication Platform allows the integration of MEMS wafers with standard CMOS wafers using a patented wafer-to-wafer bonding process. These CMOS-MEMS wafers are packaged and tested in fairly standard operations.

InvenSense Inc. (NYSE:INVN) provides MotionTracking solutions for consumer electronic devices using its patented Nasiri-Fabrication platform and patent-pending MotionFusion technology. More information can be found at www.invensense.com.

View recent issues of the MEMS Direct newsletter

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...