Endicott Interconnect names David Van Rossum new CFO

Electronics, optoelectronics, and semiconductor packaging and solutions company Endicott Interconnect Technologies (EI) has appointed David W. Van Rossum to the position of Chief Financial Officer effective immediately. In the CFO role, Van Rossum is responsible for the financial plans and policies of the company including establishing and maintaining fiscal controls; preparing and interpreting financial reports; ensuring financial resources are available to meet strategic objectives and safeguarding company assets.

Van Rossum spent 20 years with Tyco International and was VP/CFO of Tyco Telecomm from 1997-2002. More recently, David was CFO at Russound as their CFO and COO and is currently on the Board of Directors at Service Credit Union. Most of his financial experience has been in high-tech manufacturing and in Government contracts. "David’s broad and diverse financial and leadership experience will bring added value to the company as we continue to focus the organization on growth and operational excellence," said James J. McNamara, president and CEO at EI. "I am confident he will make a significant contribution in this complex environment."

David earned his MBA from the University of Southern New Hampshire. He also possesses a BS in Business Administration from New Hampshire University.

SOURCE: Endicott Interconnect Technologies; http://endicottinterconnect.blogspot.com/2012/03/endicott-interconnect-appoints-new.html

Courtesy of Gail Overton, senior editor, OptoIQ.com.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...