Invensas face-down die packaging replaces SODIMM

April 11, 2012 — Semiconductor maker Invensas Corporation, a wholly owned subsidiary of Tessera Technologies Inc. (Nasdaq:TSRA), unveiled a DIMM-IN-A-PACKAGE multi-die face-down (xFD) packaging architecture for memory semiconductors in low-profile devices like ultrabooks and tablet computers.

The DIMM-IN-A-PACKAGE design delivers the memory capacity and performance of a small outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package. The number of dynamic random access memory (DRAM) chips in the package is flexible. A Quad Face Down (QFD) DIMM-IN-A-PACKAGE can replace a single-sided SO-DIMM in a 16 x 16 x 1.0mm form factor.

The aim is reduced motherboard size and complexity, increased battery life, and reduced heat from the package.

Invensas will demonstrate its xFD technology in booth GE23 at the Intel Developer Forum (IDF), April 11 and 12, 2012 at the China National Convention Center in Beijing.

Invensas will present its Ultrabook DIMM-IN-A-PACKAGE solution at the International Conference on Electronics Packaging (ICEP) at Tokyo Big Sight in Tokyo, Japan. Titled "A multi-die DRAM package for solder-down memory in Ultrabook and Tablet PC applications" and coauthored by Dell Inc., the paper will be part of the technical session program taking place in Room B at 10:50 AM on Friday, April 20, 2012.

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), acquires, develops, and monetizes strategic intellectual property (IP) in areas such as circuitry design, memory modules, 3D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. Go to www.invensas.com.

Visit the Advanced Packaging Channel of Solid State Technology, and sign up for our Advanced Packaging News e-newsletter!

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...