Invensas face-down die packaging replaces SODIMM

April 11, 2012 — Semiconductor maker Invensas Corporation, a wholly owned subsidiary of Tessera Technologies Inc. (Nasdaq:TSRA), unveiled a DIMM-IN-A-PACKAGE multi-die face-down (xFD) packaging architecture for memory semiconductors in low-profile devices like ultrabooks and tablet computers.

The DIMM-IN-A-PACKAGE design delivers the memory capacity and performance of a small outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package. The number of dynamic random access memory (DRAM) chips in the package is flexible. A Quad Face Down (QFD) DIMM-IN-A-PACKAGE can replace a single-sided SO-DIMM in a 16 x 16 x 1.0mm form factor.

The aim is reduced motherboard size and complexity, increased battery life, and reduced heat from the package.

Invensas will demonstrate its xFD technology in booth GE23 at the Intel Developer Forum (IDF), April 11 and 12, 2012 at the China National Convention Center in Beijing.

Invensas will present its Ultrabook DIMM-IN-A-PACKAGE solution at the International Conference on Electronics Packaging (ICEP) at Tokyo Big Sight in Tokyo, Japan. Titled "A multi-die DRAM package for solder-down memory in Ultrabook and Tablet PC applications" and coauthored by Dell Inc., the paper will be part of the technical session program taking place in Room B at 10:50 AM on Friday, April 20, 2012.

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), acquires, develops, and monetizes strategic intellectual property (IP) in areas such as circuitry design, memory modules, 3D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. Go to

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