Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive components

April 4, 2012 – Marketwire — Mereco Technologies’ METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications.

The product is solvent-free, meeting NASA outgassing specification. It is also non-bleeding and thixotropic, and cures at room temperature. The adhesive has a volume resistivity @25


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