Semiconductor wafer fab equipment trends: Test

April 10, 2012 — Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step. Here, Barclays’ CJ Muse looks at the growth areas for semiconductor test.

Overall semi test intensity (% of total WFE spending) fell in 2011, from ~7% to ~5.5.

Within the test market, system on chip (SoC) test continues to climb as a percentage of overall test, rising from ~43% share in 2007 to ~64% in 2011. Memory test has continued to shrink as a percentage of the overall market, though it stayed roughly flat year-over-year in 2011.

For information on Teradyne’s LitePoint acquisition and other top test players, read Wafer fab equipment leaders in 2011 and expectations for 2012

Next in the series: Lithography trends

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