“3.5D interposer technology could someday replace PCBs” — TSMC’s Doug Yu

May 14, 2012 — At the 15th Symposium on Polymers for Microelectronics (May 8-10 in Wilmington, DE), TSMC and Yole Developpement gave plenary presentations on the use of polymeric materials in wafer-level packaging (WLP) from foundry and overall industry perspectives.

The most controversial comment came from TSMC’s Doug Yu, senior director of front-end and back-end technology development, who challenged the current nomenclature and pronounced that the versatile interposer technology should be called

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...