APNT’s new thermal interface materials meet power semiconductors’ reqs

May 23, 2012 – GLOBE NEWSWIRE — Applied Nanotech Holdings Inc. (OTCBB:APNT) uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging. The first 2 products are polymer-based (DTC-P) and ceramic-based (DTC-C).

THERCOBOND materials are designed for power electronic device packaging and dielectric coating, balancing thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability, and printability. The thermal interface composites boast a

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