SATS provider Carsem begins LED packaging and test

May 4, 2012 — Semiconductor packaging and test services provider Carsem will assemble and further develop light-emitting diode (LED) packaging technologies, partnering with a key customer.

Carsem has begun assembling and qualifying high-brightness silicon-substrate LED arrays and will ramp high-volume, full turn-key manufacturing services, including electrical testing, laser mark, and tape-and-reel, in early 2012.

To enable standard mass production, Carsem deployed matrix substrate design; auto die attach, wire bond, and high reflection coating dispense; compression molding through an automold system; substrate-mapping; and bin sort per test mapping on the LED packages.



Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...