SATS provider Carsem begins LED packaging and test

May 4, 2012 — Semiconductor packaging and test services provider Carsem will assemble and further develop light-emitting diode (LED) packaging technologies, partnering with a key customer.

Carsem has begun assembling and qualifying high-brightness silicon-substrate LED arrays and will ramp high-volume, full turn-key manufacturing services, including electrical testing, laser mark, and tape-and-reel, in early 2012.

To enable standard mass production, Carsem deployed matrix substrate design; auto die attach, wire bond, and high reflection coating dispense; compression molding through an automold system; substrate-mapping; and bin sort per test mapping on the LED packages.

Carsem

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