Semiconductor packaging house orders 14 Rudolph Technologies inspection tools

May 29, 2012 — Rudolph Technologies Inc. (NASDAQ: RTEC), back-end macro defect inspection tool supplier, will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.

The inspection tools will be installed in Q2, at multiple steps in wafer-level chip-scale packaging (WLCSP) production.

The packaging house chose to order NSX 320 systems following a competitive evaluation, in which they noted its high speed and efficient, easy-to-use operating procedures.

This is a new product for Rudolph. The NSX320 System performs defect inspection and 2D bump metrology, and acquires on-the-fly defect images at production speeds. WLCSP lines require flexibility for handling substrates in various formats while collecting detailed defect and 2D metrology information during the inspection process, said Nathan Little, vice president and general manager of Rudolph


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