EVG temporary wafer bonding platform doubles throughput for 3D packaging

July 4, 2012 — EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company’s new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and through silicon via (TSV) manufacturing.

"Temporary bonding and debonding of device wafers to wafer carriers for thin-wafer processing are critical steps to enabling the successful integration and implementation of 3D ICs into high-volume production," stated Dr. Thorsten Matthias, Business Development Director, EV Group.

A combination of hardware and software design enhancements enables double the processing throughput over EVG’s previous-generation platform, to up to 40 stacks per hour. The EVG850TB/DB accommodates up to 9 process modules, doubling the previous maximum processing capability of EVG’s temporary bonding and debonding systems. The new XT Frame-configured EVG850TB/DB is designed for EV Group’s open materials platform approach, which enables the use of a wide range of adhesives from various materials suppliers, including ZoneBOND.

The new XT Frame design enables highly efficient continuous mode operation (zero idle time) capability via an ultra-fast handling system, up to four front opening unified pod (FOUP) load ports, and a material buffer in the form of a local FOUP storage system that holds up to 10 additional FOUPs.  The platform also features an in-line metrology module option to enable real-time monitoring of the bonding/debonding process-enabling maximum yields and helping to lower production costs for thin-wafer processing.

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. More information is available at www.EVGroup.com.

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