Henkel Electronic Materials pre-cuts die attach film for 150mm, 200mm wafers

July 30, 2012 — Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film can be used as a dicing tape as well as die attach.

The pre-cut film joins LOCTITE ABLESTIK C100, a conductive die attach film in roll format.

Conductive die attach films enable uniform, consistent bondlines, eliminate die tilt, and work with thinned wafers, for leadframe and laminate packages. Films eliminate the fillet associated with paste-based die attach materials, which Henkel notes allows more die per package due to tighter die-to-pad clearance, and saves on wire bonding materials, substrate area, and mold compound usage.

LOCTITE ABLESTIK CDF 200P is compatible with commonly used lamination equipment, at lamination temperature of 65


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