MiQro Innovation Collaborative Center adds process tools, MES to MEMS facility

July 11, 2012 – Business Wire — The MiQro Innovation Collaborative Centre (C2MI) is improving its state-of-the-art micro electro mechanical system (MEMS) facility with Eyelit Manufacturing software to support R&D and the commercial activities of sponsor companies. C2MI is also installing a suite of new wafer processing tools from SPTS Technologies.

The C2MI is an international center for the development of advanced microsystems, focusing on 200mm MEMS and 3D wafer-level semiconductor packaging (WLP).

Eyelit’s software will be used to help produce prototypes and advance the commercialization of devices in fields such as information and communication technologies, automotive, aerospace, environment, and healthcare. C2MI will take advantage of Eyelit’s data partitioning capability to protect the intellectual property of C2MI members in the collaborative environment. Eyelit’s modular system offers MES, SPC, and Asset Management with fast and cost-effective deployment. Its user interface supports the concurrent display of multiple languages. The Web-based software does not require third-party software to access production data.

Eyelit’s products have recently been deployed at other research centers such as SEMATECH and CEA-Leti.

C2MI also added multiple SPTS Versalis fxP (etch, chemical vapor deposition [CVD]) and AVP thermal processing systems for through silicon via (TSV), MEMS and bulk acoustic wave (BAW) manufacturing.

The Versalis fxP, a cluster system that provides an integrated solution with multiple process steps, is fitted with Pegasus Rapier, APS, ICP and Isopod plasma etch modules together with an APM unit for plasma-enhanced CVD (PECVD). The system is used in multiple process steps including deep silicon etching, patterning of aluminum-based metals for interconnect, and the formation of aluminum nitride (AlN) bulk acoustic wave resonators in advanced packaging and MEMS applications.

The AVP vertical furnaces provide a wide variety of processes specifically developed for productive, low COO MEMS applications. At C2MI, the systems will be used to deposit thick doped polysilicon, stress-controlled Silicon Nitride and TEOS-based oxide films as well as thermal oxidation processes. In addition, SPTS will collaborate with partners at C2MI on the development of next-generation thermal technology for applications in MEMS and advanced packaging.

SPTS Technologies (a Bridgepoint portfolio company) designs, manufactures, sells, and supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced packaging, LEDs, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose, California, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com.

Eyelit Inc. makes manufacturing execution and quality management systems (MES and QMS) for the aerospace & defense, electronics, semiconductor, and solar industries. Learn more at www.eyelit.com.

The MiQro Innovation Collaborative Center (C2MI) is an international reference in the fields of advanced packaging and microsystems. The C2MI is a centre of excellence for commercialization and research (CECR) whose role is to help produce market-driven prototypes in the fields of applications of the information and communication technologies, automobile, aerospace as well as environment and health to accelerate their commercialization. The establishment of C2MI was made possible by contributions from Industry Canada, the ministère du Développement économique, de l’Innovation et de l’Exportation du Québec, Université de Sherbrooke, industrial partners and the Town of Bromont. Visit www.c2mi.ca.

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