Ultratech named advanced packaging tool supplier of choice by top-tier packaging houses

July 9, 2012 – PRNewswire — Ultratech Inc. (Nasdaq:UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and LEDs, formed ‘exclusive supplier’ and ‘preferred tool vendor’ agreements with several top-tier advanced packaging companies around the world.  Combined, these companies account for almost 60% of the electroplated flip chip market that Ultratech addresses.

Also read: Challenges in Flip Chip Assembly

These agreements, along with the recent acquisition of over 200 U.S. and foreign advanced packaging patents, strategically position Ultratech to meet the lithography packaging requirements for the future device nodes of its global customer base.  They additionally underscore Ultratech’s ongoing commitment to provide its customers with leading-edge technology solutions and low cost-of-ownership advantages.

Ultratech Vice President, Advanced Packaging Technology/Nanotechnology Markets Manish Ranjan explained, "Ultratech has maintained its leading position in AP for almost 10 years.  Several of our customers have signed multi-year agreements that range from ‘exclusive supplier’ to ‘preferred tool vendor’ because they understand the technical and economic advantages our tools deliver for advanced volume manufacturing.  These agreements highlight the close working relationship that Ultratech has with its strategic customers.  These long-term relationships provide valuable insight for the development of market-specific features that enable our customers’ next-generation devices.  Building on the recent acquisition of AP patents and the multi-year vendor agreements, Ultratech will continue to work to develop lithography systems that meet its customers’ leading-edge, advanced packaging needs."

The AP300 300-mm lithography system is built on Ultratech’s customizable Unity Platform


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