Kulicke & Soffa Industries, Inc. (Nasdaq: KLIC) launched its next generation manual wire bonder series, the iBond5000. The series, which is based on the company’s 4500 line, includes ball, wedge and dual-capability bonding options. Targeted applications include optoelectronic modules, hybrids/MCMs, microwave products, discrete devices/lasers, chip-on-boards, leads, sensors, and high power devices.
Improved features of the iBond5000 include the addition of a multi-core ARM based processor and 7” touch screen. With the improved electronics management, there are also more ways to connect to the iBond5000 via two USB ports for a mouse, keyboard or disk on key; or via Ethernet which allows for centralized management, access to an applications backup server, and capability for remote support and profile sharing. For those that prefer working with physical controls, an optional analog panel is available. The system enables saving and loading of custom files, along with factory preconfigured profiles, for storing, cataloging, and re-using golden processes.