Microsemi unveils tiny die packaging for implantable medical devices

August 27, 2012 – Microsemi has a new die packaging technology with a 75% smaller footprint vs. current implantable radio modules, for implantable medical devices such as pacemakers and cardiac defibrillators.

The company says its new die packaging technology has passed an internal qualification regime typical for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards, such as pacemakers and cardiac defibrillators. It can also be used in wearable devices such as hearing aids and intelligent patches, as well as nerve stimulators and drug delivery products.

The new internal die packaging technology continues a drive to develop miniaturized wireless medical products — it can be paired with Microsemi‘s ultralow-power ZL70102 radio to enable wireless healthcare monitoring, noted Martin McHugh, business and technology development manager of advanced packaging for Microsemi. Smaller and lighter-weight wireless medical devices will enable less invasive medical procedures and lower healthcare costs; for patients it means faster recovery times, greater mobility, and improved comfort.

"Moving forward, we plan to apply our size-reduction techniques and radio technologies to other markets such as smart sensing and applications where size and weight are critical success factors," McHugh added.

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