Rudolph wins order for advanced packaging metrology systems

September 6, 2012 – Rudolph Technologies says it has received an order for its MetaPulse G metrology system from "a premier global industry research center in Asia" for its advanced packaging process development activities.

The unidentified group will use the system, which shipped in August, for thin-film metrology performed in development and control of advanced wafer-level packaging processes that use metal structures, such as redirect layers (RDL) and under bump metallization (UBM) to route signals from the chip to the package.

"In addition to providing the fast and accurate measurements of thickness, density and roughness, its small spot size and ability to measure structures directly on product wafers allow users to see pattern dependent variations that are not detectable with monitor wafers," according to Tim Kryman, Rudolph


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