Advantest will introduce three tools at Semicon Japan

In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system. These are the wafer MVM-SEM tool E3310, mask defect review SEM E5610, and the F7000 EB lithography system for the 1x nm node.

MVM-SEM tool E3310

The multi-vision metrology scanning electron microscope, MVM-SEM E3310, measures fine-pitch patterns on a wide range of wafer types and uses Advantest’s proprietary electron beam-scanning technology.

The E3310’s multi-detector configuration allows it to achieve stable, highly accurate measurements at the 1x nm node. Its proprietary detection algorithm enables measurement of 3D FinFET architectures that are in the process of full-scale adoption by the semiconductor industry.

The E3310 performs fully automatic measurements even at high SEM magnification, thanks to its high-accuracy stage, charge control function, and contamination reduction technology. Silicon wafers, along with AlTiC, quartz, and silicon carbide wafers, among others, are supported in sizes from 150mm to 300mm, depending on type.

Mask defect review SEM E5610

The mask DR-SEM E5610 reviews and classifies ultra-small defects in photomask blanks. The E5610 inherits the highly stable, fully automatic image capture technology developed by Advantest for its multi-vision metrology SEM for photomasks and features a newly developed beam-tilt mechanism that enables scanning at oblique angles.

Its proprietary column architecture delivers spatial resolution down to 2nm, even at the low acceleration voltages appropriate for photomask screening. The E5610 also features an electrically controlled tilt module that allows its beam to tilt by up to 15 degrees for performing 3D defect reviews. The E5610 is compatible with mainstream mask inspection systems: the tool imports defect location data and automatically images the locations.

EB lithography system for 1x nm node F7000

This new F7000 electron beam lithography system supports substrates of diverse materials, sizes, and shapes, including nanoimprint templates, as well as wafers, and is optimized for diverse applications such as advanced LSIs, photonics, MEMS, and other nanoprocesses.

The F7000 offers the company’s EB technology in a system capable of writing patterns as fine as 1x nm. The system also supports template fabrication for nanoimprint lithography. Advantest has developed a new column technology—key to electron beam writing accuracy—for meeting the needs of semiconductor R&D at the 1x nm node. 

The F7000’s adjuster function enables it to write to diverse sizes of wafer, glass substrates, and square substrates. Moreover, simply by switching adjusters, the system can support silicon, gallium arsenide, and substrates of other materials, utilizing separate adjusters for each material to avoid contamination.

The systems will be featured in Advantest’s exhibit (booth #3D-803 in Hall 3) at the Semicon Japan trade show, December 5-7, in Makuhari Messe in the Chiba prefecture.

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