Singapore IME launches 2.5D silicon interposer MPW

December 19, 2012 – Singapore’s Institute of Microelectronics (IME), a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR), has launched a new multiproject wafer service (MPW) for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.

The 2.5D interposer MPW service, supported by IME’s 3D through-silicon via (TSV) engineering line, includes the following modules:

  • Leveraging industry standard Electronic Design Automation (EDA) tools to perform 2.5D TSI design, extraction and verification;
  • TSV with critical dimension (CD), e.g. 10-50

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