Novati to use Ziptronix bonding tech for 3D assembly

January 18, 2013 – Ziptronix Inc. says it has signed a licensing agreement with Novati Technologies Inc. for the use of its patented direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond).

Novati, the former SVTC facility in Austin which was acquired and relaunched by Tezzaron Semiconductor last fall, will use the technology for 3D stacking services and test. Tezzaron itself recently licensed Ziptronix’s DBI and ZiBond patents for use in 3D memory.

"Adding Ziptronix 3D process technologies to Novati’s existing wafer fabrication and testing facilities enables Novati to become the first open-platform, full-line foundry in the world offering 3D stacking services and test to all its customers," stated Dave Anderson, CEO of Novati Technologies. "We believe 3D is the new cutting edge of product development and we intend to continue our heritage as a contract R&D and lab-to-fab production facility enabling customers to cost-effectively prototype and test both 2.5D interposer and 3D designs with true, 3D integration and TSV interconnect."

"With our DBI, which contains interconnect at the bond interface, Novati can now provide technologically advanced services in many different markets at a lower cost and better performance compared to competing technologies also attempting 3D integration," added Ziptronix CEO Dan Donabedian.

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