Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets at this year’s Semicon China, taking place on March 19-21, 2013 in Shanghai.
New bonding wire innovations
Regarding bonding wires, the company shows the new silver alloy wire AgUltra. The good reflectivity surface, as well as good mechanical and electrical properties make it particularly applicable for LED device and IC packaging. Especially, silver makes this wire a cost-effective alternative to gold wires.
The MaxSoft2 is the newest copper wire in the current product range of Heraeus Bonding Wires. Due to its better workability, it can be especially used for high pin count and fine pitch applications.
Heraeus will be featuring another product in its series of solder pastes: the new water soluble halogen free solder past F590.
The water-soluble halogen free flux activation system provides excellent wetting. There is minimal void formation on a variety of substrates, component terminations and surfaces.
In its range of water cleanable fluxes, Heraeus has developed the WSD3890. It is a water soluble halogen free tack flux designed for bumping, BGA and CSP applications. Some key benefits include its excellent cleaning properties and long tackiness life.
Conference attendees can also expect to hear about Heraeus’ advances in the area of sputtering targets. These are used in markets such as hard disk drives, electronics/semiconductor, displays, glass or photovoltaics.