Signetics announces plans to increase their flip chip package assembly capacity

Signetics Corporation today announced that it has again approved capex plans that will further expand their capacity for flip chip package assembly at their factory in Paju, South Korea. The new Flip Chip expansion will be ready for volume production in July 2013 and will increase assembly capacity by more than twenty percent. This line is capable of handling boat type flip chip ball grid arrays (FCBGA) including Signetics’ new high density Super Wide Boat, as well as flip chip fine pitch BGAs (FCFBGA) with substrates as wide as 95mm.

"In the first half of this year, we have continued to see an increase in the forecasts for Flip Chip packaging from our established tier 1 and high growth customers," stated JI Kim, CEO and president of Signetics. "The growth in flip chip continues to be driven by applications such as Smart TVs, SSD and WiFi", continued Kim.

Signetics offers a range of flip chip packaging options that use industry standard bumping technologies as well as the finer pitch copper pillar bumping technology.  Substrates used for flip chip packaging at Signetics include both PBGA and FBGA as well as leadframe technologies such as QFN.  Flip chip assembly is offered in multi die or system-in-package configurations and hybrid configurations with both wirebond and flip chip connectivity for today’s new applications that require more and more system integration in a single package.

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