Toshiba Corporation and Amkor Technology, Inc. today announced that the companies have completed Amkor’s acquisition of Toshiba Electronics Malaysia Sdn. Bhd., Toshiba’s semiconductor packaging operation in Malaysia. The transaction also includes Toshiba’s license to Amkor of related intellectual property rights and a manufacturing services agreement between Toshiba and Amkor.
Under the manufacturing services agreement, Toshiba has agreed to purchase and TEM has agreed to supply packaging and test services for certain discrete semiconductor products and analog LSI products.
Toshiba positions power semiconductors as a driver of growth for its semiconductor business and seeks to maximize cost competitiveness across its front- and back-end operations. Transferring ownership of TEM to the Amkor group will allow TEM to take full advantage of Amkor’s large scale production and materials procurement capabilities and boost the overall efficiency of its power semiconductor operations.
Toshiba will continue to subcontract power semiconductor packaging and test to Amkor as an important source of key products. As it does so, Toshiba will shift its focus and resources to front-end wafer fabrication for power semiconductors by reinforcing production capabilities at Kaga Toshiba Electronics Corporation, Toshiba Group’s discrete semiconductor production facility in Ishikawa Prefecture, Japan.
Amkor expects the transaction to further strengthen its relationship with Toshiba and to grow its semiconductor packaging and testing business. Amkor plans to leverage the technology and scale of this new factory to attract leading power discrete customers to Amkor.