Mold Compound Advances Require World-Class Capability

Designed to encapsulate today’s high-performing semiconductor components, transfer mold compounds deliver critical device protection and performance stability. Indeed, they are essential materials and require expertise to formulate and manufacture, particularly when it comes to the performance needed for modern IC’s and power discretes that run at higher voltages in power management applications. Designing mold compounds that can endure in-field stresses and challenging environments takes world-class facilities, a knowledgeable team, the latest production resources and an innovation program that ensures materials for future technology requirements.

This Technology Paper brought to you by Henkel.

To view this White Paper, please log in or register

Register

* Denotes required fields
* Email Address
* Your Password
* Re-Type Your Password
* First Name * Last Name
* Job Title * Company
* Address
Address 2
* City *State/Province
* ZIP Postal Code
* Country
* Phone

Please re-type the text shown below to complete your registration:



By clicking "Submit", you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.



Henkel Corporation


Format: PDF
Size: 120.00K

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...