Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology. The module is fully compliant with the latest e･MMCTM standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Mass production will start from the end of November.
Demand continues to grow for large density NAND flash memory chips that can support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. In its official release, Toshiba said it is meeting this demand by reinforcing its line-up of high density memory products.
The company’s new 32-gigabyte (GB) embedded device integrates four 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba’s 19nm second generation process technology and a dedicated controller into a small package measuring only 11.5 x 13 x 1.0mm. It is compliant with JEDEC e･MMCTM Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard.
Toshiba said it plans to bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications.
Following 16GB and 32GB products, Toshiba will release 4GB, 8GB, 64GB and 128GB products in turn.