inTEST Thermal launches mobile temperature control system

inTEST Thermal today announced the launch of a mobile temperature control system for high-speed thermal testing of chips, components and PCBs. The Thermostream ATS-535 brings temperature to the test site by directing a stream of cooled or heated air, reaching temperatures between -60 to +225°C very quickly. Highly mobile and without the need for an external air supply, it can execute fast temperature transitions e.g. -40 to +125°C in 12 sec. This allows for thermal characterization and production verification at the test site, for example, rather than moving the test subject to a thermal chamber or custom engineered enclosure.

The Thermostream’s swivel arm and pneumatic controls allow precise connection with the device under test. System setup and control is accomplished via a controller with adjustable positioning for convenient local operation, as well as connectivity for remote operation.

ATS-535 provides a convenient thermal source for temperature testing and conditioning of small-mass test subjects in design and production environments.

The mobile temperature control system is available for ordering worldwide.

inTEST Thermal Solutions specializes in high performance thermal environments, for temperature conditioning and process cooling requirements. The company serves end users and OEMs, worldwide, in multiple industries with thermal systems such as temperature forcing units, thermal chambers and platforms, and process chillers.

ATS-535_Portable-Temperature-test-station[4]

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...