GlobalFoundries introduces 55nm automotive-specific advanced semiconductor manufacturing platform

GLOBALFOUNDRIES today introduced an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry. Built on the company’s 55nm Low Power process and AEC-Q100 Group D qualified, the solution includes a comprehensive set of technology and design enablement capabilities tailored to improve the efficiency, performance, and power consumption of automotive ICs while maintaining adherence to the industry’s strict safety and quality standards.

The automotive platform is a comprehensive solution consisting of the necessary design tool support, IP, technology, and services to leverage GLOBALFOUNDRIES’ 55nm low power process. It allows customers to quickly migrate their automotive microcontrollers, ASSPs and ASICs to a more advanced technology, leveraging the significant area, performance and power benefits of the process. The platform supports the implementation of non-volatile memory (NVM) in MCUs and SoC designs, as well as best-in-class SST-based embedded flash technology of automotive grade with an endurance of 100K erase/program cycles or higher and data retention of more than 20 years.

GLOBALFOUNDRIES, a member of the Automotive Electronics Council (AEC), has developed the 55nm automotive platform to address critical industry trends, such as increased fuel economy and safety standards, along with higher consumer demand for in-vehicle information and entertainment. By delivering a foundry-based solution, the company is providing needed advanced manufacturing capabilities and services to OEMs and IDMs that are developing more sophisticated and efficient semiconductors to power safety, body, powertrain and infotainment applications in vehicles.

“Vehicle manufacturers and their suppliers are facing extremely challenging requirements by both regulators and customers. Better fuel efficiency, higher safety standards, increased in-vehicle communications capabilities and more demanding consumer requirements are all driving the need for more performance and lower power ICs for these systems,” said Paul Colestock, director of segment marketing at GLOBALFOUNDRIES. “We are applying our advanced manufacturing technology to address these requirements directly with our focused automotive platform. This provides OEMs and IDMs with a full-service, cost-effective and reduced-risk foundry solution that enables an efficient implementation of advanced capabilities within the unique demands of the automotive electronics segment.”

Design enablement focused on unique needs of automotive sector

The platform’s complete design enablement support through certified models and design rules, PDKs and EDA tools support streamline the automotive IC design process. Its automotive-specific flow includes defect detection, defect reduction and outlier controls to provide significant improvement in quality and reliability. Robust design-for-manufacturing (DFM) support for automotive builds in quality and yield at the design stage.

The automotive platform supports the use of ARM core technology with a variety of standard cell and compilers, as well as IP blocks for GPIO, interface, and oscillator functions.

The platform is backed by an automotive services package to meet automotive grade quality and reliability requirements. The services offering includes 15 years record retention, a continuous improvement program with the aim to achieve “Zero Defects”, and comprehensive failure analysis and 8D problem resolution.

The 55nm low power process PDK, embedded flash PDK, and flash macro design service are available now.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...