Semiconductor equipment book-to-bill declines in September

North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in September 2014 (three-month average basis) and a book-to-bill ratio of 0.94, according to the September EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 0.94 means that $94 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in September 2014 was $1.17 billion. The bookings figure is 12.9 percent lower than the final August 2014 level of $1.35 billion, and is 18.1 percent higher than the September 2013 order level of $992.8 million.

The three-month average of worldwide billings in September 2014 was $1.25 billion. The billings figure is 3.3 percent lower than the final August 2014 level of $1.29 billion, and is 22.5 percent higher than the September 2013 billings level of $1.02 billion.

“Following 11 months of above parity book-to-bill ratios, the three-month average ratio declined in September,” said Denny McGuirk, president and CEO of SEMI.  “While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

April 2014

$1,403.2

$1,443.0

1.03

May 2014

$1,407.8

$1,407.0

1.00

June 2014

$1,327.5

$1,455.0

1.10

July 2014

$1,319.1

$1,417.1

1.07

August 2014 (final)

$1,293.4

$1,346.1

1.04

September 2014 (prelim)

$1,250.4

$1,172.8

0.94

Source: SEMI, October 2014

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...