Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.

To view this White Paper, please log in or register

Register

* Denotes required fields
* Email Address
* Your Password
* Re-Type Your Password
* First Name * Last Name
* Job Title * Company
* Address
Address 2
* City *State/Province
* ZIP Postal Code
* Country
* Phone

Please re-type the text shown below to complete your registration:



By clicking "Submit", you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.



Master Bond, Inc.,


Format: PDF
Size: 834.83K

LIVE NEWS FEED

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...