Silicon Cloud International launches semiconductor collaborative platform in Singapore

Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore. The pilot program included trials by the Singapore University of Technology and Design (SUTD) and Nanyang Technological University (NTU) on a collaborative design with remotely located researchers, using the SCI platform. The launch kickoff event was hosted by SUTD and was attended by about 50 professors, researchers, semiconductor industry leaders, and university students.

SCI’s cloud-based environment is used to guarantee consistency of the virtual platform, the tools used, and the data generated with laser focus on IP protection and security.

SCI provides an end to end semiconductor design infrastructure that is maintenance-free and provisioned with the latest semiconductor process technologies, production grade workflows, semiconductor Intellectual Property (IP), and Electronic Design Automation (EDA) software. SCI’s common and consistent infrastructure enables global semiconductor development and research collaboration, improves time to market, and provides secure access to leading edge EDA tools, process libraries and IP cores.

“Universities have been unable to collaborate on semiconductor design due to incompatible workflows, different EDA tool environments, IP security concerns and complexity in setting up common design environments. Silicon Cloud addresses these issues with its cloud-based, secure semiconductor workflow platform”, said Mojy Chian, CEO and co-founder of Silicon Cloud International.

Professor Yeo Kiat Seng, Associate Provost (Graduate Studies and International Relations) at SUTD, said: “With the increased complexity of today’s semiconductor designs, research collaboration amongst semiconductor research groups is critical to improve design efficiency. The multi-disciplinary environment at SUTD together with its world-class faculty will help our industry partners to accelerate the pace of innovation, both technically and in terms of generating new intellectual properties targeting a broad range of applications, including system-on-chip for future smartphones, storage, tablets and computers.”

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