Worth the detour: European 3D TSV Summit 2015 offers new outlooks on 2.5 and 3D technology

With just over a month left to go, industry experts are looking forward to the third edition of the European 3D TSV Summit (Jan 19-21, 2015 in Grenoble, France), this year focusing on “Enabling Smarter Systems.” For the past two years, the event has been a growing success, becoming internationally recognized as a “must-attend” event for companies involved in the development of 3D TSV technology. With a sold-out exhibition and an all-star lineup of conference speakers, the 2015 European 3D TSV Summit is on its way to being one of the most important events of the year for the 3D-IC industry.

Members of the 3D TSV industry have witnessed the giant leap taken by 2.5 and 3D technologies this year, with several announcements about wide scale commercialization of the technology by notable industry players. Samsung, IBM, Bosch and others have started marketing products that integrate 3D TSV or stacked-die technology, making the production of chips and systems smarter than ever. In response to this news, organizers of the European 3D TSV Summit conference have chosen to provide attendees with the most up-to-date and essential information on the business ramifications of the commercialization of 2.5 and 3D technology. Yole Developpement, who recently published a report on the outlook for the 3D-IC market, will be present at the Summit to go into more detail about their outlook for the future of 3D TSV in the marketplace. In addition to Yole, talks by AlixPartners, TechSearch International and ATREG will round out the market briefing portion of the conference.

On the technology side, speakers will include notable companies participating in the development of 3D TSV, including IBM, HP, Qualcomm, AMD, Microsoft, STMicroelectronics, ams AG, ASE Group, Broadpak, Oerlikon, and others. The program appears to offer a cross between the technological development of the 3D TSV technology and its application in finished products. Never-before-dealt-with themes, such as Glass Interposers and Photonics, will be treated during the conference, adding to the Summit’s relevance for the evolving industry of 3D technology.

For mid- to high-level executives and for top technologists working in the 3D TSV industry, the 2015 European 3D TSV Summit will be worth the detour to Grenoble, France. In addition to the top-notch conference, attendees will have a chance to network while visiting the Summit’s exhibition. Located at the heart of the Summit venue, as in past years, the 2015 exhibition is already sold out and promises to offer attendees a well-rounded view of the industry, with representatives from the entire supply chain exhibiting.

As in previous years, the Summit will also offer networking opportunities: a one-on-one meetings service, a gala dinner, lunch breaks, a welcome cocktail and numerous coffee breaks. This year’s gala dinner will be held in the Chateau de Sassenage (Sassenage Castle), bringing an element of “French charm” to the event.

For more information about the European 3D TSV Summit or to register for the event, visit www.semi.org/European3DTSVSummit or contact Yann Guillou at SEMI Europe: yguillou@semi.org.


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