SEMI Europe will ring in the New Year by holding the first major, international 3D TSV event of 2015. On January 19-21, members of the 3D TSV industry will convene in Grenoble, France for the 3rd edition of the European 3D TSV Summit. This year’s theme: Enabling Smarter Systems.
The European 3D TSV Summit’s 2015 conference will feature Keynote and Invited Speakers, a Market Briefing and a Panel Discussion. The Panel Discussion, moderated by Jean-Christophe Eloy, CEO and founder of Yole Développement, is entitled “From TSV Technology to Final Products – What Business for 3D Smart Systems ?” Panelists from AMKOR, Qualcomm, ams AG and AMD, will share their viewpoints on the 3D TSV market and the shift that many companies are beginning to make from 3D TSV technology development to the commercialization phase. Attendees can expect a lively discussion about the next big steps for the 3D-IC market.
The conference will be accompanied by a sold-out industry exhibition, featuring over 25 important industry players. Conference attendees will be invited to visit the exhibition during coffee and lunch breaks. In addition, the event will offer numerous opportunities for networking including a gala dinner and a one-on-one meeting service with dedicated private meeting spaces. With more than 125 companies planning to be present (including GlobalFoundries, STMicroelectronics, HP, Microsoft, AMD, Qualcomm, IBM, Infineon, AMKOR, ASE, NANIUM, Silex, XFAB, EVGroup, SPTS, and more…) the event promises to be a ripe ground for important professional meetings.
For more information about registration for the European 3D TSV Summit 2015 visit the event’s website: www.semi.org/European3DTSVSummit. For more information about the remaining sponsorship opportunities, contact Jérôme Boutant: email@example.com