Marktech Optoelectronics metal can packages incorporate Cree LED die

Marktech Optoelectronics, a supplier of visible and infrared LED products, introduces its latest series of high reliability metal can packages, which incorporate Cree’s LED die. Cree combines highly efficient InGaN materials with proprietary substrates to deliver superior performance for high intensity LEDs. Markech’s metal can packages, offered in different heights and lensing options, are available for single or multichip die configurations depending on the application needs.

This series of hermetically sealed TO-5, 18 and 39 packages are offered in Flat or Domed lensed options. The high lumen output of the Cree die combined with Marktech’s precise die centering capabilities make these LEDs ideal for illumination in machine vision, scanning, and medical inspection equipment.

“The die that Cree manufactures, available in a number of chip sizes, wavelengths and power outputs, are extremely stable at low or high currents, allowing equipment manufacturers a range of choices for illumination or backlighting designs” says Steve Hubert, Marktech’s product manager for Cree products.

Precise die centering within packaging is a key component to critical illumination, machine vision, and scanning applications. As illuminated surfaces continue to decrease in size, accurate detection of the scanned area relies on the correct light position.

Marktech’s series of high reliability metal can packages, offered in Blue, Green, White, and Amber colors, boast high lumen output and efficiency and can be customized into single or multichip LEDs, light arrays or miniature light rings.

Cree and Marktech will be displaying LED die products, packaged components, and chip arrays at the upcoming Photonics West show held in San Francisco from February 10-12 in booth 616.

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