Date: Date and time TBD
Free to attend
Length: Approximately one hour
Registration coming soon.
As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
Contact Jenna Johnson about sponsorship opportunities for this event.