MagnaChip to offer diversified products for Internet of Things applications

MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market. Gartner estimates that the processing, sensing and communications segments of the IoT market will grow at a compound annual growth rate (CAGR) of 29.2 percent from $7B in 2013 to $43B by 2020. This rapid growth rate outpaces the rest of the semiconductor industry which is predicted to grow at a rate of 4.6 percent over the same period.

MagnaChip offers a 0.18 micron ultra-low power technology that enables System-on-a-Chip (SoC) applications with low active and low stand-by power consumption. This new process features very low start-up voltage and enables DC-DC Boost Converters to be suitable for IoT applications. Another important technology feature is operational efficiency. This process allows for low electrical current draw, which is suitable for IoT devices such as solar cells, thermoelectric generators, vibration energy harvesters and electromagnetic harvesters.

Based on its already developed 0.18 micron ultra-low power technology, MagnaChip also plans to provide a diversified portfolio within the ultra-low power sector. This includes 0.13 micron ultra-low power EEPROM, Bipolar-CMOS-DMOS (BCD) and mixed-signal technologies. Ultra-low power technology is a key element for conserving energy usage within IoT devices. IoT applications demand an always on, low-power energy source and long battery life which are requirements that MagnaChip’s ultra-low power technology enables.

MagnaChip also offers 0.18 micron and plans to offer 0.13 micron Silicon on Insulator (SOI) RF-CMOS technologies, which is suitable for use in antenna switching, tuner and Power Amplifier (PA) applications. Switches and tuners are core components of wireless Front-End-Modules (FEMs) for cellular and Wi-Fi connectivity in IoT devices. MagnaChip’s CMOS based FEMs reduce manufacturing cost and time to market while providing competitive performance for multiband and multimode smartphones, tablets and other IoT devices.

Furthermore, MagnaChip’s 0.13 and 0.18 micron BCD technologies support high-voltage (up to 100V) and high-efficiency power ICs such as voltage regulators and converters, Power-over-Ethernet and smart LED Lighting solutions, which are essential power elements in IoT applications. With the combination of power devices with lower Specific On-Resistance (Rsp, defined as drain-source resistance times device area, Rds*A), improved isolation and higher reliability, MagnaChip’s 0.13 and 0.18 micron BCD processes will help our foundry customers to design IoT products with smaller and more power efficient characteristics.

“We believe there is tremendous growth opportunity in the IoT market and our participation is part of our overall strategy to broaden our product portfolio in new markets,” said YJ Kim, MagnaChip’s interim Chief Executive Officer. “MagnaChip’s IoT task force and business consortium with key business partners will reinforce our position as a key manufacturing service provider in the expanding IoT market.”


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