Advanced Packaging

Date: Date and time TBD

Free to attend

Length: Approximately one hour

Registration coming soon.

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Contact Jenna Johnson about sponsorship opportunities for this event.

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