Dow’s SOLDERON tin-silver plating chemistry wins prestigious Bronze Edison Award

Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced that its SOLDERON BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category.

Removing lead from solders used in electronics is a difficult technical challenge because it has unique properties that ensure device performance and reliability. SOLDERON BP TS 6000 Tin-Silver delivers a lead-free chemistry that not only creates critical connections in electronic devices, but also doubles the productivity with the market’s highest plating speed. The award recognizes Dow Electronic Materials for its development of this novel plating chemistry designed to provide advanced semiconductor packaging customers with a balance of performance and cost to enable the next generation of high-performance electronic devices, without the use of lead.

“This award showcases Dow’s ability to develop game-changing chemistry that advances the microelectronics industry while meeting customer and industry requirements for high-volume manufacturing,” said Cathie Markham, chief technology officer, Dow Electronic Materials. “The scientists who contributed to making these advances possible have collaborated closely with our customers and industry partners to understand their challenges and requirements. It is truly an honor to have our scientists and their innovations recognized by the Edison Awards.”

Dow is proud to recognize its scientists, engineers and marketers who contributed to the development of SOLDERON BP TS 6000 Tin-Silver: Jeff Calvert, Regina Cho, Jin-Sil Choi, Lou Grippo, Masaaki Imanari, Yoon-Joo Kim, Inho Lee, Yil-Hak Lee, Won-Hyun Lee, Sang-Min Park, Jonathan Prange, Yi Qin, Alex Saniuk, Taylor Wang, Julia Woertink, Ju-Mi Yun, Sam Epstein, Scott Shpunt, Kristen Finnemore, Yung-Rai Lee, Jim MacDuff, Willis Martin, Jeff Weber, Brianna Gagnon and Jianwei Dong.

The Edison Awards ceremony took place on April 23, 2015 at the Edison Awards Annual Gala in New York City. Inspired by Thomas Edison’s persistence and inventiveness, this distinguished award recognizes innovation, creativity, and ingenuity in the global economy.

SOLDERON BP TS 6000 Tin-Silver was one of five Dow products to receive a 2015 Edison Award at the gala event. Dow’s other recognized products include BETAMATE Structural AdhesivesPacXpert Packaging TechnologyPOLYOX Water-Soluble Polymers and AFFINISOL HPMC HME. For more information regarding Dow’s innovations in science and sustainability, visit dow.com.

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