Chandler, AZ – September 8, 2015 – ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies. It represents the collaborative effort of CMP Users Groups from all six major semiconductor technology regions of the world (USA, Japan, South Korea, Europe, Taiwan and China). This year’s conference includes over 100 technical presentations and poster papers, with 10 invited talks and 2 keynote speakers. A total of 36 sponsors and exhibitors will also be participating, which represents the majority of major consumables vendors and tool suppliers in the industry. To date, we have over 300 registered attendees and the list is still growing.
Technical topic areas include:
- Front end and back end CMP applications
- Process integration, control & reliability
- Consumables, equipment and metrology
- Defects and Post CMP cleaning
- CMP fundamentals, modeling and simulation
- 3D ICs/TSV applications
- CMP for MEMS
- Environmental issues related to CMP
- Emerging technologies in CMP
- Alternative planarization technologies
ICPT 2015 is jointly hosted by CMP User’s Group of the Northern California Chapter of the American Vacuum Society, Clarkson University Center for Advanced Materials Processing (CAMP), and the Institute of Electrical and Electronics Engineers (IEEE). The format for Thursday morning of this year’s conference has been adapted to be all invited talks similar to the traditional CAMP format. The speakers were selected by Professor Babu and the organizing committee from top-tier suppliers and major semiconductor manufacturers in the industry.