The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits). The deadline for paper submissions to both conferences is January 25, 2016. The late-news paper submissions deadline for the Symposia on VLSI Technology is March 24, 2016; there is no late-news submission for the Symposium on VLSI Circuits. Complete details for paper submission can be found online at: http://www.vlsisymposium.org/authors/
For the past 28 years, the combined annual Symposia on VLSI Technology and Circuits has provided an opportunity for the world’s top device technologists, circuit and system designers to engage in an open exchange of leading edge ideas at the world’s premier mid-year conference for microelectronics technology. Held together since 1987, the Symposia on VLSI Technology and Circuits have alternated each year between sites in the US and Japan, enabling attendees to learn about new directions in the development of VLSI technology & circuit design through the industry’s leading research and development presentations.
The comprehensive technical programs at the two Symposia are augmented with short courses, invited speakers and several evening panel sessions. Since 2012, the Symposia have presented joint focus sessions that include invited and contributed papers on topics of mutual interest to both technology and circuit attendees.
The Symposium on VLSI Technology seeks technical innovation and advances in all aspects of IC technology, as well as the emerging IoT (Internet of Things) field, including:
- IoT systems & technologies, including ultra-low power, heterogeneous integration, sensors, connectivity, power management, digital/analog, microcontrollers and application processors
- Stand-alone & embedded memories, including DRAM, SRAM, non-volatile and emerging memory technologies
- CMOS Technology, microprocessors & SoCs, including scaling, VLSI manufacturing concepts and yield optimization
- RF / analog /digital technologies for mixed-signal SoC, RF front end; analog, mixed-signal I/O, high voltage, imaging, MEMS, integrated sensors
- Process & material technologies, including advanced transistor process and architecture, modeling and reliability; alternate channel; advanced lithography, high-density patterning; SOI and III-V technologies, photonics, local interconnects and Cu/optical interconnect scaling
- Packaging technologies & System-in-Package (SiP)
- Photonics Technology & “Beyond CMOS” devices
The Symposium on VLSI Circuits seeks original papers showcasing technical innovations and advances in the following areas:
- Digital circuits and processor techniques for standalone and embedded processors
- Memory circuits, architectures & interfaces for volatile and non-volatile memories, including emerging memory technologies
- Clock generation and distribution for high-frequency digital and mixed-signal applications
- Analog and mixed-signal circuits, including amplifiers, filters and data converters
- Wireline receivers & transmitters, including circuits for inter-chip and long-reach applications
- Wireless receivers & transmitters, including circuits for WAN, LAN, PAN, BAN, inter-chip and mm-wave applications
- Power management circuits, including battery management circuits, voltage regulators, energy harvesting circuits
- Application-oriented circuits & VLSI systems, imagers, displays, and sensors for biomedical and healthcare applications
Joint technology and circuits focus sessions feature invited and contributed papers highlighting innovations and advances in materials, processes, devices, integration, reliability and modeling in the areas of advanced memories, 3D integration, and the impact of technology scaling on advanced circuit design. Submissions are strongly encouraged in the following areas of joint interest:
- Design in scaled technologies: scaling of digital, memory, analog and mixed-signal circuits in advanced CMOS processes
- Design enablement: design for manufacturing, process/design co-optimization, on-die monitoring of variability and reliability
- Embedded memory technology & design: SRAM, DRAM, Flash, PCRAM, RRAM, MRAM and NVRAM memory technologies
- 3D & heterogeneous integration: power and thermal management; inter-chip communications, SIP architectures and systems
Papers sought for “big integration”
Authors are encouraged to submit papers that showcase innovations that extend beyond single ICs and into the module, including focus areas in the Internet of Things (IoT), industrial electronics, “big data” management, biomedical applications, robotics and smart cars. These topics will be featured in focus sessions as part of the program.
Best Student Paper Award
Awards for best student paper at each Symposia will be chosen, based on the quality of the papers and presentations. The recipients will receive a financial award, travel cost support and a certificate at the opening session of the 2017 Symposium. For a paper to be reviewed for this award, the author must be enrolled as a full-time student at the time of submission, must be the lead author and presenter of the paper, and must indicate on the web submission form that the paper is a student paper.