Yamaichi Electronics 0.35mm pitch test contactor for semiconductor evaluation

Yamaichi Electronics presents Test Contactors for lab and reliability applications and ultra fine pitch semiconductor devices.

New semiconductor devices, like wafer level CSPs for mobile applications, have ball pitches of 0.35mm. And there is a trend to shrink towards lower pitches.

For testing such devices, Yamaichi Electronics in Europe (European headquarters in Munich, Bavaria) develops test contactors (TC) within the YED254 and YED274 series. The TC is individually modified and designed for different outline dimensions of the package. Very important is a homogeneous force distribution on the device surface to avoid device cracking.

Through Yamaichi Electronics’ experience in developing test and burn-in sockets, the opening and closing mechanism is released for easy handling. The test contactor is designed with compression mount technology, therefore no soldering is needed. Selected materials like air craft aluminum, PEEK, and ceramic PEEK make the socket robust.

This offers the customer a variety of TCs which can be used in any custom application:

  • Evaluation: the first silicon has been received to verify the functionality
  • HAST/HTOL/ELFR: reliability and stress tests for pre-qualification and during silicon production
  • ESD/Latch-Up Test: performed as part of product qualification
  • Failure Analysis: finding device malfunctions during development, production and field

To fulfill these requirements, Yamaichi Electronics has a portfolio of probe pins. The low inductance probe pin for the 0.35mm pitch has a length in working position of only 1.7mm. All pins have been electrical qualified and the standard data are available on request. This helps to select the best performing pin for our customers’ individual needs.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...