San Jose, Calif., October 29, 2015 — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. and a leader in low temperature wafer bonding technology, today announced it has entered into a development agreement with Fraunhofer IZM-ASSID. The companies will work together to integrate Ziptronix Direct Bond Interconnect (DBI®) technology into Fraunhofer’s state of the art 300mm wafer production line and demonstrate DBI as the industry’s finest pitch, thinnest and lowest total cost-of-ownership 3D integration solution.
Increasingly, the industry is looking toward 2.5D and 3D-IC solutions as the most cost effective and efficient means of delivering the next generation of high performance computing and consumer electronic products. However, conventional approaches rely heavily on thru silicon vias (TSVs), micro-bumping and underfill, which can limit interconnect density, performance, form factor and cost-effectiveness. Ziptronix DBI technology can address these limitations and accelerate the adoption of game-changing 2.5D and 3D-IC architectures.
“Although great progress has been made, the industry continues to face challenges associated with the manufacturability, scalability and cost of current 2.5D and 3D-IC solutions. Ziptronix’s DBI technology is an enabling platform that can readily address many of these challenges,” said Juergen Wolf, Head of Fraunhofer IZM-ASSID. “We at Fraunhofer are very excited to work with Ziptronix to demonstrate the benefits of DBI technology to our customers on our 300mm wafer production line.”
“DBI is the industry’s highest density, highest performance, lowest profile and lowest cost-of-ownership 3D integration platform,” said Paul Enquist, Vice President of 3D R&D at Ziptronix. “It will revolutionize the world’s most challenging 3D-IC structures and devices, and we look forward to working closely with Fraunhofer to demonstrate this enabling capability to customers around the world.”
“The acquisition of Ziptronix, and the subsequent integration of its team and technology into Tessera, has allowed us to significantly expand the 2.5D and 3D value that we bring to our customers, and the response has been incredibly positive,” said Craig Mitchell, President of Invensas. “This development agreement with Fraunhofer is an important step in the continuing development of the DBI technology as we grow our 2.5D and 3D product offerings.”