Chemical Vapor Deposition

Chemical vapor deposition (CVD) is used to produce high-purity thin films. In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile byproducts are also produced, which are removed by gas flow through the reaction chamber.

Microfabrication processes widely use CVD to deposit materials in various forms, including: monocrystalline, polycrystalline, amorphous, and epitaxial. These materials include: silicon, carbon fiber, filaments, carbon nanotubes, SiO2, silicon-germanium, tungsten, silicon carbide, silicon nitride, silicon oxynitride, titanium nitride, and various high-k dielectrics. The CVD process is also used to produce synthetic diamonds.

Applications include shallow-trench isolation, pre-metal dielectric, inter-metal dielectric, and passivation. CVD processes are also important in strain engineering that uses compressive or tensile stress films to enhance transistor performance through improved conductivity.

Additional Reading

Taking 2D materials from lab to fab, and to technology

New materials require new approaches

Deposition equipment market witnesses a year of significant change

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