Rudolph Technologies receives order for multiple NSX 330 Systems in Asia

Rudolph Technologies, Inc., has received an order for over $15 million from an unnamed foundry in Asia for multiple NSX 330 Systems.

The systems will be used for inspection of next-generation fan-out wafer level packaging products, including whole-wafer inspection and post-saw inspection. The systems will begin shipping in the fourth quarter of 2015 with the majority shipping in the first quarter of 2016.

“We are pleased to partner with this industry leader to provide the market-leading NSX System for their next-generation packaging line,” said Mike Goodrich, vice president and general manager of Rudolph’s Inspection Business Unit. “Key factors of this win were the systems’ superior inspection sensitivity, capture rate, and throughput for two-dimensional (2D) inspection, while meeting the automation challenges inherent with fan-out wafers and film frames. Additionally, all systems will be equipped with Rudolph’s Discover Yield Management Software that enhances the user’s process analysis capability in real-time, enabling fast yield improvement and increasing the productivity of each tool and the overall fab yield. This level of process visibility is quickly becoming essential to factory efficiency.”

“Rudolph has been enabling its customers’ development of advanced packaging processes for nearly two decades. We are pleased that our experience, combined with our unique fusion of hardware and software solutions, was selected to help our customer quickly ramp and control such a critical project,” said Mike Plisinski, CEO of Rudolph. “The development of advanced packaging solutions is a priority for many of our customers, as more of their customers specify packages utilizing fan-out, panel, and copper pillar technology to reduce the cost of devices while improving performance.”

Plisinski adds, “While the 2016 forecast for the overall semiconductor industry remains relatively subdued at 1.9 percent growth, according to Gartner, the development of next-generation advanced packaging processes continues to be an important growth driver for Rudolph. We are pleased that our comprehensive solutions-process, process control, and software-are helping to enable this growth.”


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...