TSMC this weekend announced that the earthquake of 6.4 magnitude which struck southern Taiwan at 3:57 a.m. on February 6, 2016 did not cause any serious personnel injuries nor any structural or facility damage to the Company’s Fab 14 and Fab 6 manufacturing sites in the Tainan Science Park. The earthquake also did not cause equipment to shift position.
Damage to wafers in progress remains under assessment, but TSMC’s initial estimate is that more than 95 percent of the tools can be fully restored to normal in two to three days. The company is deploying personnel from Hsinchu and Taichung sites to support recovery in Tainan, and does not expect the earthquake to affect first quarter 2016 wafer shipment by more than 1 percent. TSMC will soon notify affected customers and will recover any lost production as soon as possible.
Acting spokesperson Elizabeth Sun told Reuters that staff was safe and the firm’s Tainan facilities were structurally intact.