The 2016 International Group IV Photonics Conference, sponsored by the IEEE Photonics Society, has announced the Call for Papers seeking original research on the Novel Materials & Nanophotonics; Photonic Devices; and Silicon Photonics Applications & Systems. The conference is scheduled for 24 – 26 August, 2016, at the Grand Kempinski Hotel Shanghai in Shanghai, China.
The Group IV Photonics Conference (GFP 2016), now in its 13th year, delivers insights on current and future innovations in Group IV element-based photonic materials and devices, including silicon photonics, as well as other integration and fabrication technologies. Scheduled as a single-track conference, GFP 2016 facilitates personal interaction between colleagues, including oral and poster sessions of contributed and invited papers, as well as a plenary session with overviews of important Group IV element photonics topics.
Paper submission is now open, and the final deadline is 24 April, 2016. Authors will be notified in late July of their paper status. The complete Call for Papers can be found at http://www.gfp-ieee.org/call-for-papers.
Papers are invited in the following areas:
• Novel Materials & Nanophotonics – covering advanced materials, structures, phenomena, and devices still in the investigative stages. Novel materials and material combinations that enable new applications and new nanophotonic structures will be presented, including graphene, complex oxides, amorphous materials, photonic crystals, subwavelength structures, gratings, and plasmonics.
• Silicon Photonic Applications & Systems – includes demonstrations of complete system architectures and integration schemes that demonstrate the future application potential of silicon photonics, including chip-level subsystem integration, as well as integration with other electronics technologies such as microfluidics.
• Photonic Devices – covering new developments in device design, fabrication and testing to address a wide range of photonic functions based on Group IV integration, including on-chip light sources, high-speed modulation, photo detection, optical coupling WDM, filtering and routing. Other topics sought include biomedical and environmental sensing devices, devices to facilitate wafer-scale testing and cost-effective packaging technologies.
For registration and other information about GFP 2016, visit http://www.gfp-ieee.org/